Michael Tong is a highly experienced engineer specializing in materials science and engineering, holding a Ph.D. from the University of California, Los Angeles. With a significant tenure at TSMC North America from September 2009 to December 2011, Michael served as a Principal Engineer in the R&D Advanced Packaging Division, where contributions included the establishment of advanced package design rules and processes. As Project Manager for Package and Backend Technology, notable achievements included the development of the first integrated fan-out wafer-level package and leading conversions for major customers. Michael's professional journey includes roles as Staff IC Packaging Engineer at Fitbit, Packaging Technologist at Google, and Principal Engineer for Chip Development at Berkeley Lights, Inc. Currently, Michael is serving as Silicon Partnerships Manager at Meta since April 2022.
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