Mike Chiang has significant experience in the semiconductor and tech industries, having served as an R&D Engineer at TSMC from October 2017 to May 2022, where responsibilities included process development and material evaluation for InFO technology in IC packaging and 3D Fabric. Currently, Mike is employed at Meta as a Display and Module Integration Engineer since May 2022. Mike holds a Ph.D. in Material Science and Engineering and a Bachelor's degree in the Interdisciplinary Program of Engineering (IPE), both obtained from National Tsing Hua University.
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