Ming Lei

Ming Lei is an accomplished manufacturing engineer with extensive experience in the design and development of advanced packaging technologies for leading technology companies. Currently serving as a DFX Manufacturing Engineer at Meta since June 2021, Ming specializes in SMT/SiP within the AR/VR domain. Prior roles include significant contributions as a DFM at Apple, where leadership of cross-functional teams enhanced the development of SiP and optical sensing modules for the Watch program. Ming's earlier experience encompasses package design engineering at Broadcom and various engineering roles at Intel Corp, focusing on advanced assembly processes. Academic achievements include a PhD in Electrical Engineering and multiple master's degrees, reinforcing a strong foundation in materials science and engineering.