Minseok Ha is an accomplished thermal engineer currently working at Meta since February 2025, focusing on data center hardware design and related technologies. Previously, Minseok served as a packaging R&D engineer at Intel Corporation from March 2017 to February 2025, where responsibilities included designing and optimizing thermal and mechanical solutions for large form factor bare-die packages within the Thermal Core Competency team. Minseok holds a Doctor of Philosophy (PhD) in Mechanical Engineering from the Georgia Institute of Technology, earned between 2011 and 2017.
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