Peng Chen

Peng Chen has extensive experience in mechanical engineering, specializing in camera design and thermo-mechanical analysis. Prior to the current position as Staff Mechanical (Camera) Design Engineer at Meta, which began in May 2022, Peng served as a Senior Mechanical Engineer at Intel Corporation from August 2013 to February 2016, leading projects focused on thermo-mechanical analysis of various packaging technologies. Subsequent roles included Staff Mechanical Engineer at SanDisk, responsible for thermo-mechanical modeling, and Senior Mechanical (Camera) Design Engineer at Apple, where significant contributions were made to the design of Lidar scanners and other advanced camera components for iPhone and iPad. Peng holds a PhD in Mechanical Engineering and a Master of Science in Applied Mathematics, both from Brown University.