Sheng-Chieh Yang

Sheng-Chieh Yang is a Senior Hardware Engineer at Meta, where they are currently applying their extensive expertise in hardware engineering. Previously, they worked at Apple as a Senior Hardware Engineer from 2019 to 2021, focusing on product/process integration for various high-profile products like the HomePod mini and MacBook Pro. Prior to that, from 2017 to 2019, they served as a Principal Engineer at TSMC, developing next-generation packaging processes and collaborating on mass production implementation. Sheng-Chieh holds a Dr.-Ing. in Semiconductors and Microsystems from Technische Universität Dresden, where they graduated Magna Cum Laude, and they published three peer-reviewed papers during their tenure as a Research Assistant. They also earned a BS in Engineering from National Tsing Hua University and an MS in Electrical and Electronics Engineering from National Taiwan University.