Shih-Ching Wang

System Integration Process Lead

Shih-Ching (Sunny) Wang has extensive experience in the semiconductor industry and materials science, holding positions at notable companies including Meta, Corning Incorporated, TSMC, and Integrated Silicon Solution, Inc. Currently serving as System Integration Process Lead at Meta since November 2021, Shih-Ching drives integrated module control and process technology development for semiconductor manufacturing. Previous roles include Senior Process Engineer at Corning Incorporated, focusing on statistical analysis and new process development, and Process Engineer at TSMC, where Shih-Ching contributed to process technology advancements. Shih-Ching holds a Master of Engineering in Materials Science from the University of Pennsylvania and a Bachelor of Engineering in Materials Science from National Tsing Hua University.

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