William Bao is an experienced engineer with a strong background in both digital design and ASIC development. From April 2019 to March 2021, William worked as an ASIC RTL Design Engineer at Qualcomm, focusing on low-power, high-speed microarchitecture for computer vision and video codec applications. Currently, William serves as a Digital Design Engineer at Meta, specializing in AI/ML ASIC RTL and power design for AR/VR applications. Previous experience includes research roles at the University of California San Diego and Caltech, as well as practical engineering internships at HP. William holds a Master of Science in Computer Engineering from the University of California San Diego and a Bachelor of Science in Electrical Engineering from Caltech.
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