Ashish Chaple is a Principal Applications Engineer at Microchip Technology Inc., starting in March 2022, where responsibilities include collaborating with Hyperscaler and Tier 1 AI and storage customers to define PCIe switch requirements and manage firmware deliverables throughout the product lifecycle. Prior to this role, Ashish served as a Senior Embedded Firmware Engineer at Continental and an Embedded Firmware Engineer at JVCKENWOOD. Additionally, Ashish worked as a Product Development Engineer at Qualcomm, achieving a design win for a wireless transceiver chipset used in the iPhone and independently developing RF SAW filter products for mobile applications. Ashish holds a Master’s Degree in Embedded Systems from Nanyang Technological University Singapore and a Bachelor of Engineering in Electronics Engineering (Embedded Systems) from Vishwakarma Institute of Information Technology.
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