Ashish Chaple is a Principal Applications Engineer at Microchip Technology Inc., starting in March 2022, where responsibilities include collaborating with Hyperscaler and Tier 1 AI and storage customers to define PCIe switch requirements and manage firmware deliverables throughout the product lifecycle. Prior to this role, Ashish served as a Senior Embedded Firmware Engineer at Continental and an Embedded Firmware Engineer at JVCKENWOOD. Additionally, Ashish worked as a Product Development Engineer at Qualcomm, achieving a design win for a wireless transceiver chipset used in the iPhone and independently developing RF SAW filter products for mobile applications. Ashish holds a Master’s Degree in Embedded Systems from Nanyang Technological University Singapore and a Bachelor of Engineering in Electronics Engineering (Embedded Systems) from Vishwakarma Institute of Information Technology.
This person is not in the org chart
This person is not in any teams
This person is not in any offices