Brian McCarson is a seasoned technology executive with extensive experience in leadership positions in the semiconductor and technology sectors. Currently serving as Corporate Vice President and General Manager of the Data Center Solutions Business Unit at Microchip Technology Inc. since February 2025, Brian previously held the role of CTO, CISO, and Executive Vice President at Packsize from September 2023 to February 2025. Prior to that, Brian spent over two decades at Intel Corporation in various key roles, including Vice President and General Manager of the NUC Group and Vice President of the Internet of Things Group. Additionally, Brian contributed to academia as a faculty member at Arizona State University's Ira A. Fulton School of Engineering from August 2013 to May 2019. Brian's career also includes experience as a Process Development Engineer at Motorola Mobility. Academic credentials include a Master of Science in Materials Science and Engineering and Electrical Engineering from North Carolina State University, as well as a Bachelor of Science from New Mexico State University.
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