Daniel Kim, P.Eng is an accomplished engineer with extensive experience in advanced packaging technologies. Currently serving as a Senior Technical Staff Engineer at Microchip Technology Inc. since June 2018, Daniel leads technical efforts in packaging for data center and high-speed communication devices. Prior to this role, Daniel was a Principal Engineer at Microsemi Corporation, focusing on package selection and development for Enterprise Storage devices from January 2016 to May 2018. Earlier experience includes a similar position at PMC-Sierra, where responsibilities encompassed package development and vendor engagement, as well as roles at Tyco Electronics, Zenastra Photonics, and JDS Uniphase, specializing in reliability testing, optical module development, and process engineering. Daniel Kim holds a Bachelor of Applied Science in Mechanical Engineering from the University of Waterloo, earned between 1995 and 2000.
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