Hoe Hin Goh is a seasoned Principal Test Engineer currently at Microchip Technology Inc., where they support operations at Outsourced Semiconductor Assembly and Test (OSAT) facilities and drive continuous improvement in test performance and quality. They previously held several key roles at Intel Corporation, including Failure Analysis Engineer and Test Equipment Engineer, where they achieved significant improvements in tool performance and reliability. Hoe Hin has also worked as a Field Application Engineer at Teradyne and as a Staff Test Engineer at Analog Devices. They earned their Master of Engineering in Microelectronics from Multimedia University between 2015 and 2017.
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