Jason Lee is a seasoned technical expert in semiconductor yield enhancement, currently serving as a Technical Staff Engineer at Microchip Technology Inc. since January 2017, where responsibilities include analyzing and resolving die yield issues. Previously, Jason held positions at Atmel Asia Limited as a Staff Foundry Yield Engineer, and at Generalpus as a Staff Engineer in the Product Engineering Department, where new product introductions were managed. Jason's early career included significant roles at United Microelectronics Corporation, focusing on advanced technology and device research and development, and at Procomp Technology Inc., specializing in GaAs/InP HBT epitaxy. Jason holds a Master's degree in Electrical Engineering (Solid State) and a Bachelor's degree in Electrical Engineering from National Central University.
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