Marco Ho has over 25 years of experience in the semiconductor industry, currently serving as a Technical Staff Engineer at Microchip Technology Inc. since July 2011, where responsibilities include production support, managing assembly instructions, and overseeing process qualifications and performance analysis. Prior roles include serving as a Senior Member of Technical Staff at Vitesse Semiconductor and a Senior Packaging Engineer at STATS ChipPAC, progressing from a Packaging Engineer at ASAT. Marco Ho holds a Master's degree in Material Science & Engineering Management from the City University of Hong Kong, earned between 1999 and 2002, and a second Master’s degree in the same field from the same institution, completed in 1997.
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