Maye Melgo-Galimba is an experienced professional in R&D semiconductor package development and process integration. They began their career with an internship at Intel in 2004 and have since held various roles, including a FlipChip Process Engineer at Amkor Technology and a Principal R&D Engineer at Deca Technologies. Currently, Maye serves as a Manager and Tech Staff Engineer at Microchip Technology Inc., specializing in corporate packaging technology development. They hold a B.S. in Electronics Engineering from the Mapua Institute of Technology, which they earned in 2004.
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