Niles Yang

Niles (Nian) Yang is a highly experienced professional in the field of semiconductor technology, currently serving as a Data Center Solutions Flashtec Architect at Microchip Technology Inc. since October 2023. Yang's previous roles include Director of SSD System Design Engineering at Western Digital, where leadership of a team focused on Memory System Design took place, and Principal System Design Engineer at SanDisk, contributing to SSD system designs with advanced flash memory technologies. Additional experience includes leading RF IC design at an RFIC start-up, overseeing mobile flash technology at Chingis, and managing circuit design teams at Spansion. The early career consists of significant contributions at AMD in semiconductor process and device design. Niles (Nian) Yang earned a Ph.D. in Electrical Engineering from North Carolina State University and holds multiple degrees, including an MS in Biophysics from the University of Illinois Urbana-Champaign, an MS in Physics from Purdue University, and a BS in Electronics from Peking University.