Sathish Kumar K

Principal Engineer - IC Package Design

Sathish Kumar K is an experienced semiconductor packaging engineer with over 15 years of expertise in IC package and PCB design. They have focused on advanced package development and high-performance multi-die configurations, successfully delivering complex solutions for data center applications, including Switchtec and Flashtec. Their career includes roles as a Junior PCB Design Engineer at Visvam Technologies, a Senior PCB Design Engineer at Synergy Circuits Pvt Ltd, and currently serving as a Senior Engineer II - IC Package Design at Microchip Technology Inc. Sathish holds a diploma in Electrical, Electronics and Communications Engineering from Christ The King Polytechnic College.

Location

Bengaluru, India

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