Surendhar Eswaran

Surendhar Eswaran is a Principal Engineer specializing in IC package design at Microchip Technology. They have extensive experience in both flip chip and wire bond package designs, having worked with leading companies such as Micron Technology and Pactron Inc. Previously, they held positions that involved collaboration with various teams to deliver high-performance designs and manage multiple aspects of package development. Surendhar holds a Diploma in Electrical and Electronics Engineering from Rudraveni Muthuswamy Polytechnic College and a Bachelor of Engineering in Electrical, Electronics, and Communications Engineering from VLB Janakiammal College of Engineering and Technology.