AE

Angelo Espina

Package/ Process Development Team Lead - HBM

Angelo Espina is currently a Principal Engineer at Micron Technology, where they have contributed to advanced package technology development. Previously, they held various significant roles at Amkor Technology, Inc., including Principal Engineer, Staff Engineer, and Department Manager in WLCSP and process integration engineering. Additionally, at PSI Technologies, they served as Engineering Manager, overseeing the production ramp of Power QFN products. Angelo is pursuing a Master of Business Administration at De La Salle University and holds a Bachelor's degree in Metallurgical Engineering from Mapúa University.

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