Casey Smith is a seasoned engineering manager currently working as a Sr. Manager in TD NAND Device Engineering at Micron Technology, where they leverage their expertise in the semiconductor industry. With previous roles as a Principal Engineer and a Sr. Manager in NAND Product Development at Micron, Casey has demonstrated a strong background in non-volatile product engineering. Prior to that, Casey held various positions at IM Flash, including Process Integration Manager and RDA Process Engineer. Casey earned a Bachelor of Science in Electrical Engineering and Computer Science from the University of Wisconsin-Madison in 2001.
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