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Chen Jun Lin

Advance Packaging Product Development Engineer

Chen Jun Lin is an innovative and driven product development engineer currently at Micron Technology, specializing in advanced packaging technology. With a First Class degree in Mechanical Engineering from UTM, Chen Jun Lin has hands-on experience in semiconductor manufacturing, equipment design, and process optimization. Previously, they interned at Texas Instruments, where they contributed to cost-saving proposals and equipment improvements, honing their skills in data analysis and IoT systems. Passionate about sustainability and operational efficiency, Chen Jun Lin is adept at solving complex engineering challenges with a global perspective.

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Kulai, Malaysia

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