Daniel Kim is a seasoned professional in the semiconductor packaging industry with extensive experience at Micron Technology since September 2018, currently serving as Senior Manager, after progressing from Manager, where responsibilities included advanced packaging development for High Bandwidth Memory products, and Senior Engineer, focusing on managed NAND packages. Prior experience includes a role as Senior Manager at Amkor Technology, Inc., from March 2012 to August 2018, where Daniel developed 2.5D and 3D TSV packaging and later transitioned to wafer-level fan-out packaging for heterogeneous integrated solutions. Daniel holds a Master’s degree in material science from Sejong University.
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