Deep Tandel

Deep Tandel is a highly experienced engineer specializing in physical design within the semiconductor industry. Currently serving as a Staff Engineer in HBM SoC Physical Design at Micron Technology since July 2025, Deep previously held positions at Rivos Inc. and Qualcomm, where contributions included synthesis, static timing analysis, and low power design on mobile and automotive cores. Deep's expertise extends to supporting Qualcomm CPU blocks during tool evaluation and deployment at Cadence, leading customer engagements, and automating processes through Tcl scripting. With academic credentials including a Master of Science in Electrical and Computer Engineering from the University of Florida and a Master's degree in VLSI and Embedded Systems from Dhirubhai Ambani University, Deep possesses a solid foundation in electronics and communication engineering from Nirma University.