Denis Fu is a Senior Product Development Engineer at Micron Technology, where they have been since 2024. Prior to this role, Denis served as a Product Development Engineer at Micron from 2022 to 2024 and as a Process Engineer at ASEK from 2020 to 2022. With over five years of experience in wafer dicing, their expertise includes HBM3E, stealth dicing, and various wafer processing techniques. Denis is currently pursuing a Master's degree in Chemical and Material Engineering at National Kaohsiung University.
This person is not in the org chart
This person is not in any teams
This person is not in any offices