Hari Haran

IC Package Layout Design Engineer at Micron Technology

Hari Haran is currently serving as an IC Package Layout Design Engineer at Micron Technology since May 2022. Prior to this role, Hari Haran held positions at Qwave India, first as a PCB Design Engineer from June 2013 to October 2016, and then as a PCB Design Engineer Team Lead from September 2019 to May 2022. Additional experience includes serving as a PCB Design Engineer Team Lead at QCAD Engineering Services Private Limited from November 2016 to September 2019, along with freelance work as a PCB Designer from July 2011 to March 2013. Hari Haran holds a Diploma in Electronic and Communications from Government Polytechnic College, Krishnagiri, obtained between 2008 and 2011, and completed secondary education at Hindu Higher Secondary School from June 2004 to April 2008.

Links


Org chart

No direct reports

Teams

This person is not in any teams


Offices

This person is not in any offices