Henry Bathan

Henry Bathan is a semiconductor professional with over 30 years of hands-on engineering and process improvement experience in high-volume semiconductor packaging assembly and test manufacturing. Currently serving as a Senior Technical Program Manager at Micron Technology, Henry has a notable track record that includes managing Offshore Supplier Assembly & Test (OSAT) operations and contributing to new product development across various companies such as STATS ChipPAC and Semtech. With a strong foundation in product costing, engineering, and team management, they hold over 150 granted patents and have expertise in multiple semiconductor packaging technologies. Previous roles include Product Engineer at Hewlett-Packard and Senior Process Engineer at ASE Electronics, showcasing their extensive capabilities in the field.