Jerwin Magbalot is a Senior Engineer in NVM PDE Package Integration Engineering at Micron Technology, where they have been since 2019, managing Multichip package NPI from design to high volume manufacturing. Previously, Jerwin worked as a SIP Technical Support Engineer and Flipchip Senior Engineer at ASE Group Global, focusing on project management for new projects. Their earlier experience includes roles as a Wirebond/Continuity Process Engineer and Mold/Encapsulation Process Engineer at Texas Instruments. Jerwin holds a Master of Science in Management Engineering and a Bachelor of Science in Mechanical Engineering, both from Saint Louis University in the Philippines.
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