John Guzek is a semiconductor technology development executive with over 28 years of experience in advanced packaging. Currently serving as the Vice President of Substrate and Advanced Packaging Technology Development at Micron Technology, Guzek has a proven track record in new technology invention, development, and deployment to high-volume production. Prior experience includes roles at Intel Corporation, where Guzek led significant initiatives in substrate technology integration and innovation, contributing to over 50 patents and foundational packaging architectures. Guzek holds multiple degrees from the Massachusetts Institute of Technology, including Master’s and Bachelor’s degrees in Materials Engineering.
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