Joshern Loo is a Principal Engineer at Micron Technology, specializing in Metrology and Real-Time Defect Analysis for High Bandwidth Memory advanced packaging. With over a decade of experience in the semiconductor industry, they previously held roles at Intel Corporation and ASML, where they focused on product development and e-beam solutions, respectively. Joshern has a Bachelor's degree in Electronics Engineering from Universiti Sains Malaysia and has demonstrated a commitment to driving innovation and operational excellence throughout their career.
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