Ken Chan

Ken Chan is a CE Product Yield Enhancement (PYE) Engineer at Micron Technology since April 2022, specializing in electrical device characterization and fault isolation to identify failure mechanisms. Prior to this role, Ken served as a Failure Analysis R&D Engineer at Intel Corporation from July 2019 to April 2022, focusing on component failure research to enhance product yield, quality, and reliability, as well as evaluating integrated circuits and systems to ascertain root causes of failure. Additionally, Ken worked as an IoT Platform Application Engineer at Intel, contributing to the design of an Intel Configuration Tool and preparation of work documentation. Ken holds a Bachelor's degree in Electrical and Electronics Engineering from Universiti Teknologi Malaysia, completed in 2019.