LIM WEE BOON is a highly experienced engineer with a background in product engineering and verification within the semiconductor industry. LIM's career began with an internship at Technip in July 2014, followed by significant roles at Micron Technology from August 2015 to March 2020, including positions as SSD Verification and Characterization Product Engineer and NAND Functional and Design Validation Senior Product Engineer. During this time, LIM led initiatives for Micron's 140-series 176-layer QLC NAND flash memory, achieving zero escapes from first silicon through to qualification. Currently, LIM serves as a Senior Product Engineer in the Adaptive and Embedded Computing group at AMD, a position held since July 2022. LIM holds a Bachelor of Engineering degree in Telecommunication from the University of Malaya, completed in 2015.
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