Ling Pan is a Senior Package Simulation Engineer at Micron Technology, a position held since 2014. Prior to this role, Ling worked as a Simulation Engineer at ASM from 2008 to 2014 and at SAE Magnetics from 2007 to 2008. Ling earned a Master’s degree in Solid Mechanics from Harbin Engineering University between 2005 and 2007.
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