Lingming Yang is an HBM Architect at Micron Technology, where they have been working since 2022. Prior to this role, Lingming held various positions at Micron Technology, including Member of Technical Staff in HBM Architecture and Sr Product Engineer focused on 3DXP product and reliability. Lingming also gained experience as a TD Q&R Engineer at Intel Corporation in 2017. They earned a Bachelor of Science in Microelectronics from Fudan University, a Master of Science in Solid State Devices from Fudan University, and a Doctor of Philosophy in Electrical and Electronics Engineering from Purdue University.
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