Loc Ngo is a Senior HBM Package Product Engineer at Micron Technology, where they have been employed since 2025. They previously held roles including Maintenance Controller at Anheuser-Busch InBev from 2018 to 2019, Yield Engineer at Intel Corporation from 2019 to 2025, and Technical Engineer at HOYA LENS VIETNAM CO. LTD. from 2015 to 2016. Loc completed a Master's degree in Global Production Engineering & Management at Vietnamese-German University, graduating in October 2018, and gained early experience through a summer internship at Chyang Sheng Vietnam Co., Ltd. in 2017. Known for their eagerness to learn and problem-solving skills, Loc continuously seeks to expand their knowledge in engineering, production, and quality management.
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