Ming Hung Lai is currently the HBM NPI Sr. Assembly Process Engineer Lead at 美光科技, where they have developed expertise in 3DiC, flip chip, and HBM TCB process development since 2018. With 8 years of experience in advanced assembly process engineering, they possess in-depth knowledge of grinding, dicing, and die bonding techniques. Prior to this role, Ming worked as a Research and Development Engineer at PTI 力成科技 from 2014 to 2017, focusing on epoxy mold compound grinding processes and tools evaluation. Ming earned a Master's degree in Materials Sciences from 國立成功大學 between 2012 and 2014.
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