Patrick Chua is a Senior Die Attach Process Engineer at Micron Technology, where they have been contributing since 2021. With a solid background in the semiconductor industry, Patrick previously held positions as a Die Attach Process Engineer at SanDisk from 2015 to 2017 and as a Senior Die Attach Process Engineer at Western Digital from 2017 to 2021. Patrick holds a Bachelor's degree in Mechanical Engineering from Universiti Sains Malaysia, earned in 2015, and is skilled in process engineering and improvement, as well as proficient in Microsoft Excel and PowerPoint.
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