Patrick Tandy is a Business Operations Senior Analyst with extensive expertise in semiconductor packaging, including materials selection and quality control. With over 20 years of experience, Patrick has honed project management skills by leading teams of 20+ individuals and has a strong background in data analysis and problem-solving. Patrick has previously held positions at Micron Technology, where responsibilities included financial analysis, product cost modeling, and supply chain coordination. Their educational background includes engineering degrees from Boise State University and the University of Idaho.
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