拹仁 程 is a Senior Assembly Process Engineer at 美光科技有限公司, having commenced this role in 2024. Previously, they accumulated substantial experience at 矽品精密股份有限公司, where they served as Process Engineer and Equipment Engineer, focusing on projects like the SDBG (Stealth Dicing Before Grinding) Process. Their tenure at 南茂科技股份有限公司 included two years as a New Technology Development Section Manager, where they led initiatives to optimize manufacturing processes. They hold a bachelor's degree in Engineering from 國立虎尾科技大學, earned in 2008.
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