楊博智

博智 楊 is the Manager of Package Development Engineering at 美光科技有限公司, where they oversee 22 research and development engineers in the bumping and assembly process technology development. They have a strong background in package development, having successfully managed projects related to 3D stacking, wafer level fan out packages, and high bandwidth memory technologies. Prior to this role, 博智 worked as a Senior Package Engineer at Dialog Semiconductor and as a Senior Technology Development Engineer at 艾克爾國際科技股份有限公司, contributing to various innovations in wafer-level chip-scale packaging. 博智 holds a Master's degree in Mechanical Engineering from 國立中正大學, which they completed in 2012.