Richa Padhye is a seasoned process engineer currently working at Micron Technology since September 2025 as a Member of Technical Staff in HBM. Previously, Richa spent over seven years at Intel Corporation, holding various roles including Staff Pathfinding Integration Engineer in Packaging R&D, where noteworthy accomplishments included leading advancements in hybrid bonding technology and providing critical technical insights to executive leadership. Richa also served as a Senior Packaging R&D Engineer, successfully qualifying innovative EMIB technologies for major product releases, and as a Senior TD Module and Yield Integration Engineer, enhancing manufacturing processes through effective tool qualification. Richa's academic background includes a Ph.D. and M.S. in Mechanical Engineering from Texas Tech University, along with a B.S. in Mechanical Engineering from Savitribai Phule Pune University.
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