Ryan Peng is a Senior Manager at Micron Technology, where they focus on NVM Packaging Development Engineering. Previously, they served as a Deputy Manager at ASE Group from 2000 to 2005 and held roles as a Senior Quality and Reliability Engineer and Senior Packaging Engineer at Intel from 2014 to 2017. Ryan is currently pursuing both a Master of Science in Mechanical Engineering and a Bachelor of Science in Materials Science at National Taiwan University of Science and Technology.
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