Tom Diehl

Tom (TC) Diehl is a Senior High-speed Test Engineer at Micron Technology, specializing in the validation and characterization of advanced NAND designs. They graduated from Washington State University in May 2015 and have since held various engineering roles at Micron, focusing on test methodologies and data analysis. Tom began their professional career as an Android Test Engineering Intern at Intel and has also contributed as an Undergraduate Researcher and Engineering Sales Intern. Currently, they are involved in posting engineering job opportunities at Micron, particularly for new graduates and interns.