Trevor Plaisted is a seasoned professional with extensive experience in the semiconductor field, currently serving as a Member of Technical Staff in Dry Etch Pathfinding at Micron Technology since September 2018. Trevor has a strong focus on masking technologies for High Aspect Ratio patterning and carbon-containing films. Previously, Trevor owned and operated Great Harvest Bread Co. and held various engineering roles, including MTS Process Engineer at TowerJazz, Dry Etch Engineering Group Leader and Sr. Dry Etch Process Engineer at IM Flash Technologies, and Dry Etch Process Engineer at Intel Corporation. Trevor began a career in research as a Research Associate at Pacific Northwest National Laboratories and has advanced academic credentials, holding a Master of Business Administration from Brigham Young University and a Bachelor’s degree in Chemical Engineering from the University of Washington.
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