Wei-Hung (Jack) Tang is a Senior Engineer Lead in Advanced Packaging Integration at Micron Technology, specializing in advanced packaging processes and materials development since 2023. Previously, they held positions as a Senior Engineer and Research Development Process Engineer at TSMC, focusing on PVD process yield and engineering plastics development at Chang Chun Chemical Group. Wei-Hung earned a Master of Science in Chemistry from National Taiwan University between 2011 and 2013. They possess extensive experience in material characterization and reliability testing, along with strong communication skills for collaboration with cross-functional teams and external stakeholders.
This person is not in the org chart
This person is not in any teams
This person is not in any offices