Wei Zhen Lim is a Senior Package Development Engineer in Tech Dev at Micron Technology, a role they have held since 2021. Prior to this, they worked at Amkor Technology, Inc. as a Senior Process Development Engineer and gained extensive experience in semiconductor packaging during positions at Fairchild Semiconductor, Kulicke & Soffa, and Western Digital. Wei Zhen is currently pursuing a degree in Electrical Engineering with a focus on Power Systems at Universiti Malaysia Pahang.
This person is not in the org chart
This person is not in any teams
This person is not in any offices