Weiber Wu

Weiber Wu is a Senior Package Reliability Engineer at Micron, specializing in Flip Chip components and ASIC/controller package assembly processes. They possess expertise in conducting risk assessments for reliability issues using advanced methodologies such as Weibull distribution, and have a solid focus on quality through various analytical techniques. Previously, Weiber assisted in criminal case paperwork at the Nantou Prosecutor Office during their alternative military service and held roles in package reliability engineering at Micron, where they monitored reliability during high-volume manufacturing and contributed to new product introductions. Weiber earned a B.S. in Mechanical Engineering from National Taiwan University.