Xavier Wu is an experienced IC industry professional with 13 years of expertise in IC design, assembly, packaging manufacturing, and substrate manufacturing. Currently a Sr. Product Development Engineer at Micron Technology, Xavier organizes packaging development projects and leads initiatives for cost-saving opportunities. Previously, Xavier held positions as a Sr. Staff Engineer at TDK InvenSense and a Sr. Production Engineer at Egis Technology, where they successfully enhanced package robustness and optimized manufacturing processes. Xavier earned a Bachelor of Electrical Engineering from Tamkang University in 2009.
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