Yashvi Singh is a dedicated professional currently working as a Senior Front End Technology Development Capital Supplier Development Manager at Micron Technology. They previously held roles including R&D Product Development Engineering Intern at FormFactor Inc. and Graduate Student Researcher at Stanford University, where they co-authored a paper for the InterPACK 2020 Conference. Yashvi has also contributed to various research positions at prestigious institutions such as the Indian Institute of Technology, Madras, and the Defence Research and Development Organisation. They are pursuing a Master's degree in Materials Science and Engineering at Stanford University while also holding a Bachelor's degree in Metallurgical and Materials Engineering from the National Institute of Technology, Tiruchirappalli, where they graduated as Valedictorian.
This person is not in the org chart
This person is not in any teams
This person is not in any offices