Kun Yao is a Senior DFA Engineer at Microsoft, where they focus on design for assembly strategies. Previously, they served as a Mechanical Engineering Manager at Motorola Mobile Devices and as a Mechanical Engineering Director at Techfaith Wireless, overseeing mobile devices development. Kun also held roles as a Mechanical Engineer at CECW and as a Mechanical Engineering Lead at Intel Corporation, contributing to various mobile device projects. They earned a Bachelor's degree in Architecture design of missile from Beihang University.
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