Mike Kesem is a Sr. Logic Design Engineer at Microsoft, where they focus on memory subsystems, including Row Hammer and memory security. Prior to this role, Mike worked at Micron Technology as a DDR Design Engineer, contributing to the design of DDR4, DDR5, and LPDDR5 technologies. Their experience also includes positions as an ASIC Design Engineer at Intel Corporation and a Senior ASIC Engineer at Qualcomm, where they specialized in advanced digital IP design. Mike holds a Master of Science in Electrical and Electronics Engineering from Boise State University and a Bachelor of Science from Ben-Gurion University of the Negev.
Location
Morrisville, United States
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